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 Synopsys introduced its 3DIC Compiler platform to transform the design and integration of complex 25 and 3D multidie system in a package It provides an unprecedented fully integrated, highperformance, and easytouse environment, offering architectural exploration, design, implementation, and signoff with signal, power, and thermal integrity optimizations, all inSignoff Verification of 25/3D Stacked Die Assemblies Provides complete design verification of stacked die assemblies Delivers 3D assembly LVS for assemblies such as stacked memories, stacked sensor arrays, interposerbased structures, or packagelevel RDL routing AMD GPU VEGA Product 25D/3D Package with HBM2 • AMD GPU Vera Package Supply Chain • GLOBALFOUNDRIES GPU and interposer • ASE Assembly • Samsung HBM2 • IBIDEN laminate subtrate TSV inside HBM and Silicon Interposer •

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2.5 3d packaging- 3D is an overused term that means different things to different people Some call 25D a 3D technology Technically, a DRAM stack, which has been wirebonded, is also 3D "Traditionally, 3DIC means something with a throughsilicon via through an active die People are taking that in different directions," ASE's Rice explained IFTLE 461 Samsung 3DIC XCube;

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Select a packaging style, quantity, and choose from custom or stock sizes – then start designing your custom boxes Add customization options like images, text, and any color your brand requires As you design you'll see an instant quote so you know exactly what your final order will come to Get started now Tiny minimums 25/3D wafer level packaging is one of the important key technologies in advanced microelectronic packaging and system integration worldwide This concept has specific advantages in terms of heterogeneous integration of multiple devices such as sensors, processors, memory ICs and transceivers with excellent electrical performance and small form factor In order to unify all the different names it gives to its variants of its 25D and 3D packaging, TSMC has introduced its new overriding brand 3DFabric 3DFabric makes sense as a brand to tie the

25/3D IC Package Thermal Modeling Modeling heterogeneous 25/3D ICpackage thermal chippackageinteractions is important for several reasons Designing a large high power device, eg a AI or HPC processor without considering how to get the heat out is likely to lead to problems later on, resulting in a suboptimal packaging solution fromSome sophisticated 25D assemblies even incorporate TSVs and 3D components Several foundries now support 25D packaging 6 7 8 9 10 The success of 25D assembly has given rise to "chiplets" – small, functional circuit blocks designed to be combined in25/3D HI Packaging – Foundation and Future Vision Author Douglas J Sheldon Subject 21 NEPPETW Presentation Created Date AM

25D (twoandahalf dimensional, alternatively pseudo3D or threequarter) perspective refers to one of two things Gameplay or movement in a video game or virtual reality environment that is restricted to a twodimensional (2D) plane with little to no access to a third dimension in a space that otherwise appears to be threedimensional; 25/3D Level Heterogeneous Integration • Heterogeneous Integration • In the context of describing 25D/3D packaging level of technology • Integrating dissimilar chips using a packaging technology with I/O density higher than organic substrate (Feature size smaller than organic substrate, or 3D die) • Technology drivers • High bandwidth 25D/3D packaging technologies are revitalizing creativity in high technology products We thought we knew what faster, better, lighter and smaller meant 25D/3D packaging can revolutionize what we thought possible but it will require augmenting our current methods and tools One key methodology to add would be Path Finding

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• Scalable compute packaging is an emerging trend – Single small die is used for low end needs;High density 3D IC applications, filled 210 μm diameter, up to 81 aspect ratio and 1050 μm pitch;Figure 1 illustrates 25/3D stack packaging trends from those that are in the development stage to those that are now mainstream The 25D covers segmented die with passive TSV interposer within package or active interposer with packages, also known as system in a package (SiP) The 3D packaging consists of stacking

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David Schor 25D packaging, 3D packaging, CoEMIB, EMIB, Foveros, Intel A look at ODI, a new family of packaging interconnect technologies that bridges the gap between Intel's EMIB (25D) and Foveros (3D) by providing the flexibility of an EMIB in 3D with additional benefits of thermal & power Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 25/3D Chip Designs Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 25/3D designs for hyperscale, communications and Threedimensional (3D) packaging with throughsiliconvias (TSVs) is an emerging technology featuring smaller package size, higher interconnection density, and better performance;

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Vias can be filled or barrel coated;25/3D IC Package Planning Early prototyping and exploration allows engineers to evaluate different ASIC/chiplet, interposer, package, and PCB integration scenarios in order to meet overall PPA, device size, routability, and cost goals prior to detailed physical implementation25D packaging using silicon interposers with TSVs is an incremental step toward 3D packaging

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25D is a packaging methodology for including multiple die inside the same package The approach typically has been used for applications where performance and low power are critical Communication between chips is accomplished using either a silicon or organic interposer, typically a chip or layer with throughsilicon vias for communication While communication between chips 1325D/3D TSV & Wafer Level Integration Technology & Market updates 19 Sample wwwyolefr ©19 In this report ADVANCED PACKAGING PLATFORMS Focus on 3D stacking packaging platforms in this report No substrate FanOut WLCSP Organic substrates Wirebond BGA CSP COB BOC WB CSP LGA FlipChip BGA FC BGA FO on Substrate 25/21D 3D*Intel Announces Hybrid Bonding By Phil Garrou Blogs Samsung's XCube Samsung has announced that its advanced 3D integrated circuit (IC) packaging technology, dubbed "XCube," is now available for

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  #2 In general, 3D packaging's processing feature sizes are huge (in microns vs in nanometers in actual leading edge logic devices) So ASML does not play a role in this space (or at least EUV is not needed, and will never be needed) Instead, lithography equipment handling bigger features but with higher productivity, like fromAutomated verification of 25/3D IC latchup prevention With the Calibre PERC reliability platform, an automated 25/3D IC latchup prevention verification methodology is available that addresses the multiple challenges inherent in advanced latchup protection for multidie packages25D & 3D Packaging Cost Model Which applications are right for this technology?

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Huemoeller , " Market Demand Readiness for 2 5 / 3 D TSV Products " IMAPS 12 Device Packaging Conference , Scottsdale , AZ March 5 12 2 S Arkalgud , " 2 5 and 3 D• 25/3D packaging process and materials are more sophisticated than in the traditional flip chip packaging technology o The industry mainstream SoA 25/3D package assembly process, materials, and business model are not currently compatible with low volume production for mil/space components Most experts believe that full 3D packaging is at least five years away from mainstream deployment 25D, in contrast, already has made inroads in markets where price sensitivity is low and demand for throughput to memory is extremely high, such as networking, server and graphics applications

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Fig 1, which shows a modern 25D test vehicle including packaging technologies such as silicon interposer and micropillar interconnects 3 Figure 1 shows two fullwaferthickness dice, which are stacked on a thinned silicon interposer The dice package is25D & 3D Packaging Indium Corporation is a world leader in the design, formulation, manufacture and supply of semiconductorgrade fluxes and associated materials, enabling 25 and 3D assembly processes, as well as more standard flipchip assemblyLower density 25D/3D package architectures, 1050 μm diameter, aspect ratio of 41 to 61 and μm pitch;

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 Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 25/3D Chip Designs Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 25/3D designs for hyperscale, communications and2D graphical projections and similar techniquesPower & Signal integrity prototyping in system technology cooptimization (STCO) High Density Advanced Packaging (HDAP) using chiplets & 3D packaging Using a System Technology CoOptimization (STCO) approach for 25/3D Heterogeneous Semiconductor Integration

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Heterogeneous and homogeneous 25/3D IC package connectivity planning and prototyping for system technology cooptimization Full or Partial Schematics Import Package assembly logical connectivity can be constructed by using full or partial graphical schematics, useful for high device count designs such as SiP modules and/or the reuseTogether with 25D/3D packaging this extends Moore's Law at systemlevel Times have changed The industry is seeking alternatives to design and manufacture the latest Systems on Chips (SoCs) using System in Package (SiP) and chipletbased approaches by leveraging HighEnd Packaging to mix both the latest and mature nodes 25D/3D packaging25/3D packages (Quasi) monolithic integration (System in Package or SIP) is an ongoing trend to increase functionality and reduce cost This includes technologies such as the integration of multiple active and passive (prepackaged) components into one overmold package, diestacking and package stacking

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Use the model to for your product Include supplier specific details and incoming die preparation in your analysis View the detailed costs—including labor, material, capital, tooling, and yield impacts—for every step Labor rate Lot size Overhead rate 25D And 3DIC LatchUp Prevention 25D/3D ICs have evolved into an innovative solution for many design and integration situations, but they present unique verification obstacles that challenge electronic design automation (EDA) tools originally designed for 2D ICs Automated solutions are needed not only to reduce verification cycles but also 2D vs 25D vs 3D ICs 101 By Max Maxfield 6 I see a lot of articles bouncing around the Internet these days about 25D and 3D ICs One really good one that came out recently was 25D ICs are more than a stepping stone to 3D ICs by Mike Santarini of Xilinx On the other hand, there are a lot of other articles that have "3D ICs

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Comprehensive 25/3D IC packaging design solution for heterogeneous IC/chiplet integration that utilizes a STCO IC packaging process methodology This study explored Through Glass Via (TGV) Formation Technology by using Focused Electrical Discharging Method for alkalifee glass which has well matched CTE with Si 25D/3D Packaging has presently attracted lots of attention, an interposer is recognized as one of key materials, and its development of new fine pitch, high dense, and low cost interposer areMany small dies are packaged in parallel for high performance needs • Datacenter bandwidth and performance needs are driving photonic packaging Application Package Types Data Center • Large 25D packages with HBM and ASIC w/ 3D SRAM

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 25/3D IC Packaging Technologies Part 1 Overview IEEE/CPMT, Herb Reiter eda2asic Consulting IncHerb Reiter, eda2asic Consulting, Inc herb@eda2asiccom 1 eda2asic AGENDA Part 1 Introduction eda2asic EndUseMarkets for 25/3DPackaging should be the same as what is found in a retail store, unless the item is handmade or was packaged by the manufacturer in nonretail packaging, such as an unprinted box or plastic bag item 4 Western Digital WD Blue 25" 3D NAND SATA SSD Solid State Drive 1TB **NEW** 4 Western Digital WD Blue 25" 3D NAND SATA SSD Solid Close mobile search navigation Article navigation Volume 13, Issue 1

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  25D/3D packaging I've spent most of my career in the ASIC business In 03, Gartner predicted the ASIC market would grow to $169B During that time, there were a number of startups building ASICs, but the applications were a bit specialized and aimed at new marketsWafer thinning (to < μm Si thickness) and processing on temporary carrier wafer

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